On September 4th, NXP Semiconductors and China's automotive electronics industry leader Shenzhen Hangsheng Electronics Co., Ltd. (hereinafter referred to as “Hangsheng”) signed a strategic cooperation agreement at the “2018 NXP Future Technology Summit”. On the basis of past product and technology cooperation, we will carry out long-term and in-depth joint research and development, and work together to deeply cultivate innovative fields such as smart travel and connected cars.
Based on this agreement, NXP and Hangsheng will focus on leapfrogging in smart security assistance and body control, in-vehicle infotainment and more. The two companies will jointly develop the next generation of smart car based on NXP's total solution, which covers NXP's i.MX8 application processor, S32K processor, power management chip, radio DSP chip, high-performance Class D digital amplifier, Ethernet chip, etc. The new generation of smart cabins will truly provide a “cloud-pipe-end” overall solution in the entire intelligent networked vehicle system, combining local processing capabilities with cloud connectivity, integrating more efficient and efficient hardware device platforms and enriching the scene experience. The software platform relies on big data and intelligent core algorithms to provide smarter, safer and more precise customized services for users' environments and user behaviors.
Based on the ARM® Cortex®-A53 and Cortex®-M4 cores, the i.MX 8M family of application processors deliver industry-leading audio, voice and video processing for everything from consumer home audio to industrial building automation and mobile computers. application.
The MYZR i.MX 8MQuad Evaluation Kit (EVK) provides a fast evaluation platform for the i.MX 8MQuad, i.MX 8MDual and i.MX 8QuadLite application processors using 2 to 4x Cortex-A53s and 1x Cortex-M4 cores. It features high performance, low power, flexible memory options and high-speed interfaces, as well as industry-leading audio and video capabilities.
This Evaluation Kit supports HDMI output for easy out-of-the-box operation. Provides LPDDR4, eMMC, QSPI and SDMicro memory options, 10/100/1000 Ethernet ports, USB 3.0 connectors and PCIe standard high speed interfaces. For audio and video evaluation, it brings HDMI 2.0a Type-A and MIPI-DSI connectors, as well as 32-bit audio sampling, audio interface expansion connectors and 3.5mm audio jack headphones up to 768kHz sampling rate.
With the rapid development of artificial intelligence Internet of Things and big data in recent years, safe and connected cars are welcoming new opportunities for development. Intelligent and networked has become a globally recognized new direction for the development of the automotive industry. Advanced automotive electronics technology has become the core competitiveness of the automotive industry, and its upgrading has been accelerating. MYZR is committed to the development of embedded core boards. All products are independently researched and developed independently, and all products have independent intellectual property rights. We are NXP's IDH, providing complete embedded products and total solutions to help customers quickly design, develop and produce high performance, high reliability products.