I.MX8M core module
Model: MY-I.MX8M-CB300
Front view
MY-IMX8M-CB300 parameter
Hardware Configuration
CPU | i.MX8MQ/D | Quad / Dual Core |
Memory | DDR4 2GB | Expandable to 4GB |
Storage | eMMC 4GB | Expandable to 16GB |
Operating temperaturetemperature range
● 0℃~70℃（Business grade）
●-40℃~85℃（Industrial grade）
Storage temperature
●-60℃~125℃
Operating system support
●Android
● Linux
Hardware interface
Interface Specifications | Maximum Configurable Interfaces | Description | |
Communication interface | Ethernet | 1 | 1 way 10/100 / 1000Mbps EthernetIEEE802.3-2002 |
USB | 2 | 2 SuperSpeed USB3.0 (up to 5Gbps), compatibleUSB2.0 | |
UART | 4 | 4 UARTs, each up to 4.0Mbps | |
PCIe | 2 | 2 way PCIe Gen 2.0（5.0 GTps） | |
I2C | 3 | 3 way I2C，stand by 400kbps | |
SPI | 2 | 2 way eCSPI（Enhanced CSPI），Up to 52Mbps each | |
PWM | 4 | 4 way 16-bit up counter with clock source selection，4X16 FIFO | |
External memory interface | NAND | 1 | 8-bit NAND flash, stand by ECC and BCH for error detection |
QSPI | 2 | Two quad external serial flash device interfaces, stand by XIP mode | |
SD3.0/SDIO | 1 | 4-bit SD and SDIO card transmission, up to UHS-I SDR-208 mode（Up to 208MB / s） | |
multimedia | HDMI | 1 | 1 way HDMI 2.0a，stand by 4096x2160@60Hz，stand by HDCP 2.2和HDCP 1.4，20+ audio interleaved 32-bit |
DSI（MIPI interface） | 1 | 1 4-channel MIPI display interface, stand by high-speed mode (1.5Gbps per channel),stand by 1920x1080@60Hz， | |
CSI(MIPI interface) | 2 | 2 way 4-channel MIPI camera interface, stand by high-speed mode (1.5Gbps per channel），stand by 4K@30fps | |
SAI | 5 | 5 channels I2S / SAI / AC97 / TDM, 1 channel with 16 Tx and Rx, 1 channel with 8 Tx and Rx, 3 channels with 2 Tx and Rx | |
S/PDIF | 1 | 1 S / PDIF stereo transceiver, stand by input and output | |
MY-i.MX8M-CB300 core board includes a quad-core processor composed of Arm Cortex-A53 core, running speed up to 1.5GHz, with Gigabit industrial Ethernet, enhanced security and functional safety features; one general-purpose Cortex-M4 core processor has the advantages of efficient signal processing, low power consumption, low cost, and ease of use.
The size of the MY-i.MX8M-CB300 core board is only 5cmx5cm, which can be easily applied in most devices on the market. The advanced manufacturing process has a great influence on the performance and service life of the core board. The high-density 10-layer PCB 2nd-order laser blind buried hole process and the carefully designed empty slot for fan installation ensure excellent heat dissipation performance. Make the product more efficient and durable. In addition, the core board also uses a board-to-board connection, which makes product use more reliable.
For more details, please refer the link: http://wiki.myzr.com.cn/index.php?title=MY-IMX8M-CB300_Hardware_Introduction
